Application scenarios: IC original \/ liquid glass crystal \/ PCB circuit board \/ optical fiber, photosensitive original CCD \/ silicon wafer \/ quartz crystal \/ industrial ceramics \/ other electronic components
Description: SMT surface mount technology covers many aspects, such as electronic components, integrated circuit design and manufacturing technology, circuit design technology of electronic products, design and manufacturing technology of automatic mounting equipment, development and production technology of auxiliary materials used in assembly and manufacturing Etc. The harm of moisture to the semiconductor industry is mainly manifested in that moisture can penetrate into the IC through the IC plastic package and from the gaps such as pins, and the resulting pressure causes the IC to absorb moisture. In the heating process of the SMT process, the moisture entering the IC Thermal expansion to form water vapor, the resulting pressure causes the IC resin package to crack, and the internal metal of the IC device is oxidized, resulting in product failure. In addition, when the device is soldered on the PCB board, due to the release of water vapor pressure, it will also lead to virtual welding. According to IPC-M190 J-STD-033 standard, SMT components exposed in high humidity air environment must be placed in an electronic drying box with humidity below 10 percent RH for 10 times the exposure time to recover the components' "" Workshop life "to avoid scrap and ensure safety. In the electronics industry, moisture-proof cabinets are often widely used to store IC accessories and PCB circuit boards, and to remove some residual moisture.
Solution: Gezhi low-humidity and ultra-low humidity series moisture-proof cabinets are professionally designed according to the application requirements of the electronic industry, providing reliable storage solutions for electronic industry applications, and the minimum humidity can reach 1% RH. At the same time, our ultra-low humidity anti-static series moisture-proof cabinets can be properly Preserve electronic components with demanding storage conditions and avoid the influence of moisture and static electricity on precision electronic components.
At present, smd products include top view and side view. It is a common problem in the industry that dead lights appear during customer reflow soldering, and moisture absorption control is also an effective method to solve this problem. The main methods are:
\u003Ci>1．\u003C\/i> \u003Cb>1.\u003C\/b>\u003Ci>缩短产品制程时间,严重按照等级要求控制产品成型后空气中的置放时间.\u003C\/i> \u003Cb>Shorten the product process time, and strictly control the placement time in the air after the product is formed according to the grade requirements.\u003C\/b>
\u003Ci>2．\u003C\/i> \u003Cb>2.\u003C\/b>\u003Ci>对宜吸湿原物料生产前做烘焙除湿处理.\u003C\/i> \u003Cb>Baking and dehumidification treatment should be done before the production of hygroscopic raw materials.\u003C\/b>
\u003Ci>3．\u003C\/i> \u003Cb>3.\u003C\/b>\u003Ci>控制生产现场的温度\/湿度,半产品放置在干燥柜（ ）中.\u003C\/i> \u003Cb>Control the temperature\/humidity of the production site, and the semi-products are placed in a drying cabinet (moisture-proof cabinet).\u003C\/b>